Our temperature shock chamber is designed for conducting highly dynamic thermal cycling tests with precisely defined transfer durations. It enables reproducible and standards-compliant temperature cycles with rapid transitions between low and high temperature ranges. The test specimen is deliberately subjected to thermomechanical stresses realized through abrupt air temperature changes or exposure in temperature-controlled liquids.

The transfer between temperature zones occurs within a defined and validatable time period, ensuring consistent test conditions

and high process reliability. The rapid temperature change effectively tests material stresses, differences in expansion coefficients, solder joints, encapsulations, and structural transitions. The system is therefore ideally suited for qualification, reliability assessment, and service life simulation of components and assemblies in research, development, and quality assurance.

The system is designed for high cycle stability and long-term operational reliability. Precise temperature control, homogeneous air circulation, and optimized insulation and sealing concepts ensure uniform temperature distribution and minimize unwanted temperature losses.

Reproducible test results are achieved while maintaining high energy efficiency.

A wide range of options and expansion possibilities is available to adapt to specific customer requirements.

We are pleased to provide personal consultation to configure the temperature shock chamber optimally for your individual testing requirements.